Used AMAT / APPLIED MATERIALS Centura DPS II #9390588 for sale

AMAT / APPLIED MATERIALS Centura DPS II
ID: 9390588
Etcher Process: Metal, W.
AMAT / APPLIED MATERIALS Centura DPS II reactor is a multi-zone rapid thermal reactor system designed for semiconductor fabrication. It is used in a wide variety of processes, from deposition to dope activation, thin film oxidation to etching. The DPS II operates at high temperature, enabling rapid thermal processing (RTP), an essential step in modern semiconductor manufacturing. It can reach temperatures of up to 1150°C in seconds, far higher than traditional furnace systems. As a result, it allows tight control of process conditions at the nanometer level, enabling the development of innovative, high-performance devices. The DPS II's multi-zone configuration includes three independent processing zones—an integrated resistively heated susceptor, an infrared heating lamp, and an oxidizing chamber. This design results in superior control of process conditions, as well as a smaller foot-print and low-cost operation. Additionally, the several independent temperature zones allow the user to define the optimal thermal profile for a given process. The system also features Adaptive Process Control (APC), a proprietary technology that ensures uniform processing by dynamically adapting the temperature and pressure profile in accordance with the changing process conditions. This minimizes the undesirable side-effects of rapid thermal processing (RTP), such as arsenic segregation, particle contamination and quantization of microstructures. The DPS II also utilizes advanced optical and spectrometric feedback systems to automate the thermal profile and optimize the process parameters in real-time. This allows the user to quickly define the optimal process, and helps to ensure a high level of yield and product quality. Finally, the DPS II is also suited for complex process integration and automation. It utilizes both standard and proprietary software protocols, as well as a variety of interfacing options, including Networked I/O and EtherCAT. This allows the monitoring of process variables in real-time and integration with external systems, greatly simplifying the operation of the reactor and allowing maximum operational efficiency.
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