Used AMAT / APPLIED MATERIALS Centura DPS+ #9233287 for sale

ID: 9233287
Wafer Size: 8"
Vintage: 2000
Metal etcher, 8" Mainframe: Centura Phase2 Chamber A & B: DTCU: EDTCU Gate & throttle valve: Pentium & throttle valve, VAT EDWARDS STP-H1303C Turbo pump Pumping tube: Heated ENI QMW-25 Generator (Source) ENI OEM-12B Generator (Bias) ESC: Ceramic EPD: Monochromator Chamber C&D (ASP+): ASTEX AX-2115 Microwave generator Tuner: Auto tuner Chamber E: Fast cooldown Chamber F: Orieter Xfer: VHP Robot L/L: Narrow tilt-out Gas panel: Chamber A & B: Gas / Size / Model N2 / 20sccm / 8160 O2 / 500sccm / 8160 Ar / 200sccm / 8160 CHF3 / 20sccm / 8160 SF6 / 200sccm / 8160 BCL3 / 100sccm / 8160 CL2 / 200sccm / 8161 Chamber C & D Gas / Size / Model N2 / 500sccm / 8160 O2 / 5000sccm / 8160 N2 / 1000sccm / 8160 VDS Missing parts: Process chamber chiller & hose EPD Monitor rack 2000 vintage.
AMAT / APPLIED MATERIALS Centura DPS+ is an advanced plasma-enhanced chemical vapor deposition (PECVD) equipment designed to meet the demands of next-generation OLED displays and other microelectronics applications. AMAT Centura DPS+ provides a selection of chambers to suit any deposition requirements, with a Delta chamber designed for the deposition of basic cells, a sigma chamber designed for compound semiconductor deposition, and a Stripe chamber designed for depositing rectifying films with stripe-shaped targets. This allows for a broad range of deposition capability, from ultra-thin films to films over two millimeters thick. The apparatus comes with many features to improve processing speeds and yields, such as multiple process control capabilities, including temperature control using ultra-precision control systems, micron-level uniformity and repeatability, real-time automated load-locking, variable-frequency RF sputter power supplies, and customizable end-point detection. In addition, the system operates semi-automatically and can be programmed accordingly to process wafers in a variety of shapes and sizes. It features low-temperature processing, and plasma-activated gas discharges enhance deposition rate, uniformity, and quality. The high-purity process gases used in the unit offer excellent film uniformity and process stability. APPLIED MATERIALS CENTURA DPS+ also offers exceptional plasma control with fully adjustable power and pressure levels, allowing users to fine-tune process parameters to achieve optimal material performance. Special multi-chamber clustering architectures enable high-throughput cluster processing. Furthermore, high-precision integrated alignment fixtures and automatic wafer loading platforms minimize manual labour. Overall, AMAT / APPLIED MATERIALS CENTURA DPS+ offers advanced processing capabilities for next-generation OLED display deposition and other microelectronics needs. With its range of features, the machine offers an efficient and reliable platform for deposition and etching requirements.
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