Used AMAT / APPLIED MATERIALS Endura CL #9191120 for sale

AMAT / APPLIED MATERIALS Endura CL
ID: 9191120
Chamber AL TxZ CPI-VMO.
AMAT / APPLIED MATERIALS Endura CL is an advanced PECVD reactor designed to enable next-generation semiconductor device fabrication. AMAT Endura CL is equipped with a configurable process chamber architecture, allowing it to easily adapt to various process recipes. It offers superior compatibility with existing substrates, optical films, coatings, and metals. APPLIED MATERIALS Endura CL features an innovative, shielded dual-furnace design, which enables advanced temperature control, allowing the temperature of the process chamber to be maintained at a precise level over a wide range of operating temperatures. As a result, the reactor can be used to create uniform layers of photoresist, poly-silicon, and other materials with tightly controlled thickness and uniformity. Additionally, Endura CL features a new multi-beam showerhead equipment, which significantly reduces the chamber pressure ripple by evenly dispersing the processing gases, leading to higher overall etch rates and uniformity. This system additionally reduces total maintenance time by minimizing particle build-up. AMAT / APPLIED MATERIALS Endura CL is a high-end PECVD reactor, offering unparalleled performance for the most critical device fabrication applications. It features a sophisticated optical unit that allows for highly accurate film thickness measurements and processes precision coatings with a tight tolerance range. AMAT Endura CL also provides a wide range of monitoring capabilities, allowing users to monitor process parameters and chamber conditions. APPLIED MATERIALS Endura CL is a highly advanced PECVD machine that enables the highest quality and most reliable semiconductor device fabrication processes. Its unique dual-furnace design and robust showerhead tool provide unparalleled versatility and a high degree of process control. Its sophisticated optical asset facilitates precise film thickness measurements and uniformity. Additionally, its user-friendly interface and monitoring capabilities make it an excellent choice for the most demanding device fabrication applications.
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