Used AMAT / APPLIED MATERIALS Endura CL #9200110 for sale

AMAT / APPLIED MATERIALS Endura CL is an advanced silicon-based physical vapor deposition (PVD) reactor commonly used in semiconductor device fabrication. It has been designed to enable advanced deposition processing techniques in high-volume production. AMAT Endura CL PVD reactor has a modular platform design, providing excellent flexibility to configure for a wide array of process integration. The front-loading, chamber-based architecture can easily accommodate a variety of tool components. This provides users with easy access and maintenance while allowing for individual customization, allowing for advanced process integration on a single platform. The reactor utilizes advanced techniques to enable the highest-quality deposition on a range of substrates. The reactor uses a range of process gases, including highly reactive organosilanes, to enable ultra-thin films with tight control over film structure and uniformity. At higher temperatures, higher deposition rates and even denser films can be obtained. Additionally, the reactor is capable of rapid substrate heating and cooling, which allows for quick turnaround times for production. APPLIED MATERIALS Endura CL reactor has a number of advanced materials handling and waste management features. Materials are loaded near the top of the reactor, then moved through the system by a series of robotic arms. Waste management is managed by a closed-loop material recycling system which allows for contamination-free operations and higher yields. The reactor design also allows for excellent process control, with precise control over temperature, pressure, gas flow and pressure containment. With advanced control over these parameters, users can achieve stringent quality requirements and greater uniformity across a range of substrates. Overall, Endura CL is an advanced PVD reactor designed for silicon-based high-volume production. It provides users with excellent flexibility to customize for a wide array of process integration, enabling advanced deposition techniques with rapid turnaround times and high yields. With precise process control parameters and advanced materials handling and waste management, users can achieve excellent film uniformity across a range of substrates.