Used AMAT / APPLIED MATERIALS Endura CL #9390614 for sale

AMAT / APPLIED MATERIALS Endura CL reactor is a plasma etching equipment with a magnetically enhanced inductively coupled plasma (ICP) source. This high-performance, high-throughput system is designed for the etching of wide variety of materials, including silicon, germanium, gallium arsenide, indium phosphide and copper. AMAT Endura CL utilizes a unique combination of inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) sources for increased etch rate, excellent selectivity, and high quality etch profiles. The housed components, including the etch chamber, plasma source, and power supplies, have been designed with precision and accuracy to ensure a clean, low-defect etch surface. AMAT CL achieves high-throughput rates with a wide range of etching parameters for fine tuning. APPLIED MATERIALS Endura CL is equipped with a four-inch etch chamber and an autotrode lift unit for precise diameter control and the highest possible selectivity. Endura CL's ICP source is composed of an external RF power generator, a magnetic field generator, and a microwave source. The ICP source produces a plume with a high concentration of ions and radicals that penetrate the workpiece faster for improved etch rates. The unique electron cyclotron resonance source allows for a lower substrate temperature during etch, reducing plasma-induced damage and enabling higher throughput rates and improved optical properties. AMAT / APPLIED MATERIALS Endura CL also offers a highly uniform etch profile and outstanding etch selectivity, especially for multi-layered structures. Its two-dimensional plate is designed to reduce sidewall variation, allowing for high-precision, high-aspect ratio structures. A high-stability chamber pressure machine ensures precision etch parameters during the etch process. AMAT Endura CL is an ideal tool for a wide variety of etching applications, such as deep hole formation in silicon substrates, high-aspect-ratio etchings for MEMS/NEMS applications, and precise micromachining of hard materials such as germanium, quartz, and aluminum. The Amino based high selectivity feature reduces contamination in the etched structure making it suitable for sensitive device structure applications. With all the features of APPLIED MATERIALS Endura CL, it is an ideal tool for high-performance, high-throughput etch processes.