Used HELLER 1809EXL #9260461 for sale

HELLER 1809EXL Reflow Oven is an automated, productive, cost effective solution for reflowing a variety of solder materials. This oven is equipped with profiled heating to ensure accurate and repeatable processes. It offers excellent temperature accuracy and uniformity of every solder joint. This machine offers precise and efficient performance at continual repeatable levels. The Reflow Oven offers a wide temperature range, from 40-400° C. This allows for the use of a variety of lead-free solder materials with ease. The ovens are equipped with up to 9 LPCM Zones and a forced convection cooling unit. This allows precise control of heat delivery for quick and even reflow processes. In addition, the use of globally available parts and components significantly lowers operational costs. HELLER 1809 EXL Reflow Oven has a user friendly, graphical touchscreen interface. This allows for easy storage and recall of oven profiles, as well as simplified setup and operation. The operator can adjust the temperature and air flow to their specific needs. This reflow oven is also capable of temperature ramping, meaning that the temperature can be gradually increased at an adjustable rate. Automatic control of the flow of air prevents over-heating on sensitive components and adjusts for production line speed variations. The constructed surface of the oven is designed with stainless steel to ensure it lasts a long time. With it's 200mm of clearance at the top and 941mm at the rear, this reflow oven can handle a wide variety of PCB sizes. The width capacity is also adjustable up to 508mm. All this together makes 1809EXL Reflow Oven an ideal choice for meeting differing product demands.