Used LOOMIS MKT 38LI #103301 for sale

LOOMIS MKT 38LI
Manufacturer
LOOMIS
Model
MKT 38LI
ID: 103301
Wafer Size: 2"-3"
Semi-automatic scriber, 2"-3" Automatic indexer.
LOOMIS MKT 38LI is an advanced scribing and dicing equipment used in semiconductor fabrication. This system utilizes high speed scanning, laser cutting, and precision motion control to accurately guide thin cutting edges for precise material removal and patterning. It is designed for the highest speed and accuracy of any scribing / dicing unit, allowing it to process substrates up to 8" on a side and up to 20μm in thickness. This machine is capable of moving quickly and precisely in order to maintain its high cutting accuracy. This is achieved through the use of advanced Polygon Scanner with a step resolution of 0.5µm, a scanning speed of up to 400Hz, and a laser spot size of 30µm. The laser can be focused to various depths without changing the focus, and is able to cut through hard materials such as silicon. The tool is also capable of freely changing the angle of the cutting head, and comes with software that allows the user to program cutting patterns, multi-level patterns and 3D structures. In order to allow the user to accurately scribe and dice materials, MKT 38LI has several features designed to keep the processed material in a stable position during cutting. This includes a powerful vacuum pump to hold the substrate for cutting, a three-axis drive asset, and a "face down" feature that helps keep the cut edge from bending or fracturing. After the scribing and dicing process is complete, the model is capable of post-processing the parts. This feature removes any remaining debris from the edges of the material, cleans the surface of the substrate, and adds a protective coating to the part. This adds to the equipment's high level of accuracy and repeatability, resulting in a finished product that meets all customer specifications. Overall, LOOMIS MKT 38LI is a powerful and precise scribing and dicing system that is capable of delivering high-quality results. It is capable of handling a variety of materials and thicknesses with accuracy and repeatability, and its post-processing feature gives it the ability to maintain high quality standards.
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