Used SELA / CAMTEK MC 500 #9043693 for sale

ID: 9043693
Wafer Size: 8"
Micro cleaving system, 8".
SELA / CAMTEK MC 500 scribing / dicing equipment is a pioneering laser based scribing and sawing technology, designed for a wide variety of dicing applications. It is capable of rapidly and accurately scribing and sawing through a variety of materials, including semiconductor substrates, glass, ceramics, composites and silicon wafers. SELA MC 500 contains an optically filtered, frequency and high power capable resonator that enables it to be used on a wide range of materials and powers. The optical design of the system provides superior precision and performance for scribing and sawing. The laser output is directed onto a 1 to 4 sided scribing / dicing optics table, which accurately and precisely focuses the laser beam at the desired cutting point. This makes it possible to accurately cut into various substrates without generating any dust. CAMTEK MC 500 also features an automated scoring unit which makes it suitable for precision scoring of fragile components. The machine is also capable of carrying out wafer sawing where a wafer is 1mm thick or less. The machine can accurately saw a single wafer, multiple wafers or multiple sections of wafers. MC 500 has a number of additional features, such as a motorized stage, optical column and table, with integrated motion control tool, to produce higher precision scribing and sawing results. The machine also has a sealed enclosure to protect against dust and dirt, thus ensuring superior long-term reliability. Additionally, the machine is configured with multiple sensors that provide feedback and assure optimal cutting. SELA / CAMTEK MC 500 is an extremely versatile and reliable piece of machinery that is easy to use and maintain and is extremely cost-effective for its class. It enables fast, accurate scribing and sawing through a variety of materials and is well suited for production, laboratory and education settings.
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