Used SHIBAYAMA VG502 MKII 8 #293638202 for sale

ID: 293638202
Wafer Size: 6"
Grinder, 6" Missing parts: Amplifier Grind spindle.
SHIBAYAMA VG502 MKII 8 is a state-of-the-art scribing and dicing equipment for precision sample preparation. This system is designed for high-precision material cutting and surface preparation in semiconductor device manufacturing. SHIBAYAMA VG-502 MKII8 utilizes a high-speed, high resolution 3-axis motion control unit, with a maximum velocity of up to 2,000 mm/s and a repeatability of less than 0.001 mm. This allows for precise positioning of the samples on the worktable for precise sample treatment. The samples are mounted on the machine using a vacuum table, and a precision vision camera is used to locate and position samples with an accuracy of up to 0.05 mm. The vision camera is also connected to a sophisticated software package, which can analyze and identify the wrinkles and defects of the sample surface, and then compensate for these defects during the processing. The tool also features a CCD camera mounted on the machine, which can inspect and analyze the cut surface in real time. The CCD camera can be used to measure the profile and shape of the cut, enabling the operator to improve upon the high degree of accuracy that is required in sample preparation. Finally, the asset can be operated with a wide range of high precision cutters and blades, including scribes, mills, saws, and scissors. These tools can be easily and accurately used to achieve the desired results when cutting and dicing the material. Overall, VG502 MK II 8 is a powerful and reliable scribing and dicing model that can provide precise, high-precision sample preparation for the semiconductor device industry. Its high-resolution motion control, precision vision camera and CCD inspection camera make it ideal for analyzing, preparing and treating samples in a variety of materials.
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