Used TECDIA TEC-1228AL #293638657 for sale

TECDIA TEC-1228AL
Manufacturer
TECDIA
Model
TEC-1228AL
ID: 293638657
Automatic wafer breaking system.
TECDIA TEC-1228AL is a highly advanced scribing / dicing equipment designed for the production of semiconductor packages. It is comprised of a scribing unit, dicing unit, precision dicing saw and a vision system. The scribing unit is designed to provide precise, uniform scribing of multiple surfaces simultaneously. It is equipped with a high power laser and up to four high acceleration axes, enabling accurate, efficient scribing and advanced function handling. In addition, the unit is designed to reduce vibration, decrease thermal distortion and ensure high quality results. The dicing unit is designed to provide a very fast and precise dicing of multiple surfaces. It is equipped with a high speed motor, allowing for high speed performance and a large working area that can accommodate up to four work pieces simultaneously. This unit is also equipped with a high power laser for removing solder mask and other small components. The precision dicing saw is designed to provide precise, uniform dicing of multiple surfaces. It is equipped with a high speed motor, allowing for high speed performance and a cutting blade that is capable of producing high precision cuts without damaging the surface. The saw is also equipped with a vision unit, enabling easy alignment of the blades for precise results. The vision machine is designed to provide high accuracy, reliable measurement and inspection of multiple surfaces simultaneously. It is equipped with a capable camera and software with capabilities to detect defects in various materials, such as scratches and chips, as well as providing accurate alignment of work pieces. Overall, TEC-1228AL scribing / dicing tool is a highly advanced asset designed for the production of semiconductor packages. It is equipped with a high power laser, high speed motor, cutting blade and vision model, enabling precise, uniform scribing and dicing of multiple surfaces simultaneously while detecting defects and providing reliable measurements.
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