Used ANATECH Hummer 10.2 #9221457 for sale

ID: 9221457
Sputtering coater With AU & palladium targets.
ANATECH Hummer 10.2 is an advanced sputtering equipment designed to deposit thin layers of material on a substrate. The system is capable of producing uniform films of metals, alloys, oxides, and nitrides with superior adhesion and rise/fall times. It also offers excellent flexibility and control via its user-friendly touch-screen interface, allowing for simple deposition parameters optimization. The Hummer 10.2 utilizes a pulsed DC sputtering process that ensures controlled thin film growth and virtually eliminates substrate charge. Its 10"x4" sputter area allows for large-area deposition of multiple layers. The chamber design includes a multi-zone uniformity unit, allowing for uniform thin film deposition at any location on the substrate. The chamber also features a number of inlet and outlet valves for the evacuation and plasma controlling processes, as well as a substrate heater for precise temperature control. The machine is equipped with a gas valve array with easy-to-use manual and automatic flow control, allowing users to toggle between gas and vacuum operations. A pressure sensor allows users to monitor the chamber pressure and quickly identify tool malfunctions. The Hummer 10.2 also comes with a variety of shield protection devices, including thermally isolated shields to keep substrates protected from the sputtering process and magnetic shields for uniformity control. The Hummer 10.2 is easy to maintain and features various safety measures. This includes an interlock asset to shut down the model automatically in the event of a fault, overpressure, or low-pressure occurrence. The equipment's compact, unified design allows for straightforward field installation and maintenance. Overall, ANATECH Hummer 10.2 is an excellent sputtering system for a wide range of materials research applications. Its adjustable substrate heating, gas flow, and pressure control provide users with precise control over thin film deposition. Its large sputter area and uniformity capabilities mean it is able to produce quality thin films on a number of substrates. The unit provides precise control in a user-friendly and easy-to-maintain package.
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