Used ACRA RS 618 #79387 for sale

ACRA RS 618 is an advanced wafer grinding, lapping, and polishing equipment that is used to finely process and polish semiconductor wafers from freshly sliced wafers through to critical advanced patterned requirements. This machinery utilizes a top of the range spindle design for superior accuracy and surface finish, can support single-sided and double-sided processing, and can support wafers to a diameter of up to 300mm. At the heart of RS 618 lies the grinding and polishing mechanism, which is designed to ensure precision performance. This utilizes a diamond-dressed spindle driven by a high-speed brushless DC motor and operates at a variable speed of up to 5000 RPM. The spindle supports interchangeable flat, rotary and cup wheels to suit various diameters and application requirements. The system also includes robotic loading and unloading capabilities, allowing for efficient, automated wafer processing. The wafer handling capabilities of ACRA RS 618 are capable of handling both flat and ground wafers and can support a variety of materials such as Si, Ge, and gallium-nitride (GaN). The loading and unloading robotics are powered by precision open loop stepper motor drives that position the wafers accurately and quickly. For better control, RS 618 includes a full suite of automatic and manual control features. This allows for close monitoring and tuning of the process parameters in real time and facilitates easy and fast changeovers between wafers. The unit also provides user-friendly programming of all the grinding, polishing, and robotic operations through its powerful and intuitive touchscreen HMI. ACRA RS 618 is highly efficient, producing results far superior to manual processing, and has been designed and built with all major global safety regulations in mind. It is a robust and reliable machine for automated wafer grinding, lapping, and polishing, providing assured and repeatable results at the highest wafer quality levels.