Used AMAT / APPLIED MATERIALS Reflexion LK Oxide #293659314 for sale

AMAT AMAT / APPLIED MATERIALS Reflexion LK Oxide is a wafer grinding, lapping, and polishing equipment. Used in the high-volume manufacturing of silicon, gallium arsenide, and other substrates, this system is well-suited to the planarization needs of the semiconductor industry. The structural components of the LK Oxide are built with industrial-grade metals and alloy components, such as stainless steel, which offers superior resistance against corrosion and rust. This piece of equipment is capable of operating at a maximum temperature of 600°C while producing a YAG laser beam with speed and precision. The intensity of the beam is calibrated and regulated through the adjustment of its beam voltage and current. In addition to its structural makeup, the LK Oxide also includes four grinding heads and two polishing/lapping plates. It can support lapping and polishing plates up to 12 inches in diameter. With the ability to rotate the plates, the unit can produce flat and uniformly polished substrates in one pass. The grinder heads come with preset diamond grits, which can be adjusted to a designated grit to produce the right finish for a variety of materials. The LK Oxide utilizes robotic arm technology to transfer the wafers from station to station. This ensures accurate and reliable machine to machine transfer and transitions with minimal wafer breakage. In addition, a quarantine station protects the wafers from additional contamination and degradation during the process. The entire machine is controlled by a proprietary software called the Reflexion Control Tool (RCS). The RCS uses multiple algorithms to calibrate and control the intensity of the laser beam in order to achieve optimal results. It also allows users to save custom programs for easy recall of prior settings and parameters. This APPLIED MATERIALS LK Oxide is an efficient and reliable asset designed for the advanced planarization needs of the semiconductor industry. Its industrial-grade components and advanced software provide superior performance and precision with minimal risk of wafer breakage or contamination.