Used BBS KINMEI E-450 #293636220 for sale

BBS KINMEI E-450
ID: 293636220
Wafer Size: 8"
Edge polishers, 8".
BBS KINMEI E-450 is an advanced wafer grinding, lapping and polishing equipment designed for precision grinding and polishing of semiconductor wafers. E-450 is equipped with a high power DC motor, which allows for high-speed grinding and lapping of the surface. The system is also coupled with a high precision pneumatic feed unit that provides both continuous and direct control of wafer movements throughout the entire process. Furthermore, its innovative engineering ensures low friction and low particle generation, offering superior smoothness and surface finish for high-end applications. BBS KINMEI E-450 utilizes an innovative electro-mechanical design for controlling the grinding/lapping process. This includes a closed loop motion controller that allows a precise control of the grinding/lapping operation and its parameters, such as stroke frequency, direction, load and speed. This provides a higher degree of precision and repeatability compared to manual operations. Additionally, it is equipped with a pneumatic buffering machine that helps to regulate grinding pressure and intensity in order to achieve an even grinding and polishing surface finish. E-450 is also equipped with a rotating diamond grinding disc and a separate indexing plate that allow it to grind and lap the surface of a wafer from the center-outwards. BBS KINMEI E-450 also has a built-in chiller that helps to cool the tool in order to prevent any potential damage to the wafer due to thermal exposure. Additionally, E-450 is configured with an advanced grinding tool holder, allowing for quick and easy tool changes as needed. Finally, BBS KINMEI E-450 is manufactured with a stainless steel protective chamber that ensures a clean and safe working environment. This chamber also includes a dust filter asset that further reduces the risk of exposure to hazardous particles. E-450 is a highly reliable model equipped with a range of features that help to reduce particle generation and deliver superior surface grinding and polishing results.
There are no reviews yet