Used BOYER-SHULTZ H-612 #9238660 for sale

BOYER-SCHULTZ BOYER-SHULTZ H-612 Wafer Grinding, Lapping and Polishing Equipment is a fully automated system that offers a highly efficient method of precision grinding, lapping and polishing of semiconductor wafers and other substrates. This unit supports up to three parallel processes, wafer preparation, lapping process and polishing, allowing for efficient production. It features a three-stage process with a two-stage multibuffering machine for final wafer cleaning and polishing. Additionally, it utilizes advanced, high-precision and advanced process control capabilities. The grinding stage of the tool involves precision ground wafers and pre-polished wafers. It is designed for ultra-smooth grinding and carries out a single- or double-sided process using a rotary grinding grinding wheel. This is followed by a controlled dress cycle that produces superior wafer edges and an improved finish. The lapping stage is a two stage lapping process that utilizes a multi-buffering asset for controlling the end surface roughness. It is capable of buffing at various stages for a wide range of applications. The lapping process is followed by a single-plate polishing step utilizing patented drive technology that achieves maximum edge integrity and thickness. The BOYER-SCHULTZ H-612 Wafer Grinding, Lapping and Polishing Model is designed for on-the-fly corrections and on-line data logging that allows for process optimization. It is also equipped with a host of software capabilities to enhance data management, including process mapping and archiving. The equipment includes a Fully Programmable Multi-Process Control software that allows for recipe-based performance. Additionally, its CNC PC controls with touch screen provides a dynamic interface for easy setup and on-line process monitoring. In summary, the BOYER-SCHULTZ BOYER-SHULTZ H-612 Wafer Grinding, Lapping and Polishing System is a fully automated unit designed to precision grind, lap, and polish semiconductor wafers and other substrates with maximum efficiency and repeatability. It utilizes advanced process control technologies and includes a multi-stage process, multi-buffering machine, patented CNC PC drives, and a host of software capabilities to achieve superior results. This tool is ideal for all types of grinding and polishing applications and is ideal for the semiconductor or microelectronic industry.