Used BOYER-SHULTZ Progrind V - R69737EL803 #9147249 for sale

The Boyer-Schultz BOYER-SHULTZ Progrind V - R69737EL803 is a wafer grinding, lapping and polishing equipment that is designed for semiconductor and optoelectronic wafers. This versatile system is suitable for grinding and polishing a broad range of semiconductor materials, such as silicon, GaAs and InP. It utilizes horizontal, stationary, and rotating rotary grinding plates to ensure that the parts are evenly and accurately polished. This unit is capable of machining complex shapes and is equipped with adjustable automatic feed and temperature control settings to give a consistent and accurate finish on a variety of substrates. It is designed for high throughput, with a rapid cycle time and a large process area. The R69737EL803 also features an ergonomic design and an intuitive user interface, to minimize operator fatigue and maximize operator comfort. The grinding and polishing process occurs in a vacuum chamber that ensures a dust-free workspace. The chamber is also equipped with a CCD imaging machine for detecting and controlling the location of the grinding and polishing head. The CCD imaging tool is connected to a computer-controlled robot arm which performs the grinding and polishing processes. The chamber is designed to eliminate variations in the part surfaces that can be caused by uneven grinding or polishing surfaces and to ensure that the results are repeatable. The chamber is also equipped with various sensors that monitor the glass wafer edges for any signs of chipping or damage. The R69737EL803 also features a range of safety features to protect the user and other personnel. The chamber is designed to suppress any sparks or flames that may be caused by static electricity. The asset also features a pressure-relief valve to regulate the pressure within the chamber in case of mechanical failure. The model is designed with a lockable enclosure to protect the operator from any hazardous particles or radiation. The Boyer-Schultz Progrind V - R69737EL803 is equipped with a state-of-the-art control equipment that allows the user to program the grinding and polishing process for a variety of materials. The system has an intuitive interface and easy-to-use control unit that enables the user to customise the grinding and polishing process. In conclusion, the Boyer-Schultz BOYER-SHULTZ Progrind V - R69737EL803 is a wafer grinding, lapping and polishing machine that is designed for the semiconductor and optoelectronic industries. The tool's ergonomic design and intuitive user interface make it easy to use, while its advanced CCD imaging asset and pressure-relief valve make it a safe and reliable way to achieve a high-performance finish on parts.