Used CERATEC JAPAN HiAZ-700 #9269784 for sale

CERATEC JAPAN HiAZ-700 is a comprehensive wafer grinding, lapping and polishing equipment designed to ensure quality precision finishing of wafers. The machine offers precise and repeatable grinding results and can perform various sophisticated processes such as deburring, grooving and surface conditioning. HiAZ-700 comes equipped with a wide range of tools, such as a vacuum chuck for high precision wafer handling, premounted grinding wheels and polishing papers, as well as a diamond burr tool. The equipment boasts a total grinding and polishing time of 1-5 minutes, on a single pass, to upgrade the surface finish quality and eliminate common defects such as scratches and pits. It also has a high precision polishing jig, which allows fine polishing and superior surface finish on the wafer in minimum time. CERATEC JAPAN HiAZ-700 further features a 6-axis robot arm and an integral vision system. The robot arm provides the user with a full range of adjustable movement, allowing for a wide variety of wafer grinding processes. The vision unit works in tandem with the robot arm to precisely monitor and control the precision and accuracy of the grinding process. HiAZ-700 is equipped with two rotational stages for grinding, lapping and polishing, with adjustable speeds from 5 to 50 rpm. It also has a temperature controller which ensures that the temperature is kept in the optimum range for the desired grinding and polishing results. Finally, the machine has a dust extraction unit to draw dust particles away from the working surface and collect them for easy disposal. Overall, CERATEC JAPAN HiAZ-700 is a comprehensive and reliable wafer grinding, lapping and polishing tool capable of perform a host of sophisticated processes. The equipped tools, robot arm, vision asset and adjustable speeds ensure an accurate and efficient grinding and polishing job with excellent surface finishing results.