Used CREATIVE 36A #9388513 for sale

CREATIVE 36A wafer grinding, lapping and polishing equipment is a reliable and high-precision manufactured machine specially designed for the preparation of process samples and structures on semiconductor wafers. The system can be used for a wide range of industrial and scientific applications, including work on-site and in research laboratories. The machine features a wide range of grinding, lapping and polishing functions, allowing for a precise and accurate finish in a shorter period of time. 36A consists of a heavy-duty stainless steel frame with a high-motorized, premium controller and a diamond-coated wafer grinding wheel. The unit is engineered with an advanced programmable oscillation movement that provides an irrationally smooth and even grinding finish on a workpiece. The machine operates through a multi-stage grinding process. This process ensures that the desired surface roughness and flatness are achieved in a safe and controlled operation. The machine carries an integrated wafer handling machine for safe, precise manipulation and placement of the wafer. It is also equipped with a high-precision spindle assembly and an intuitive user interface. An additional safety tool is included to ensure reliable performance and reduce accidents. CREATIVE 36A is suitable for use in various industries, including semiconductor, telecom, aerospace, automotive and medical device industries. The machine meets both the CE and ISO safety standards, making it ideal for use in industrial or scientific applications. The machine is serviced regularly and inspected by factory-certified personnel to ensure a safe and reliable operation. With its advanced design and high-precision construction, 36A is designed for bulk production and can effectively grind and polish large numbers of samples with a degree accuracy. This asset can significantly increase productivity and reduce the time and cost associated with wafer grinding and polishing operations. CREATIVE 36A is a great addition for any facility that needs to quickly and precisely prepare process samples or structures on wafers.