Used DISCO DFG 850 #9238626 for sale

DISCO DFG 850 is a wafer grinding, lapping and polishing equipment used for the production of highly accurate, fine-polished wafers. This advanced system is designed for the fabrication and processing of the next generation of semiconductor devices and components. It employs a powerful, variable speed brushless DC motor with variable speed control and digital feedback control to ensure smooth, uniform grinding, lapping and polishing. The unit uses a patented electrostatic chuck to secure the wafer during processing without the need for epoxy or adhesive. The machine's working surface is designed to produce an extremely flat substrate and can process wafers up to 854 mm in diameter and 8.6 kg in weight. It also offers the flexibility to switch between two different grinding media, enabling finer finish on the substrates. DISCO DFG850 is completely automated, allowing for unattended operation. It is also capable of performing compounding, polishing and lapping operations simultaneously. The tool is equipped with advanced features, including a programmable grinding controller, which maximizes cost savings by allowing for programmable motor speeds and elevated grinding parameters. DFG-850 uses an integrated cleaning station to maintain the cleanliness of the grinding media and other components, eliminating contaminants from processing and protecting the tool from damage or failure. The asset is equipped with an intuitive touchscreen human machine interface (HMI) to monitor and setup operations. It also offers versatile options such as data logging, reporting, tracking, trending and production optimization. The innovative technology of DFG 850 helps reduce time between processes and improves the quality of the products produced. The model is designed to provide high production volume and low cost of ownership, making it a valuable tool for any research and development laboratory or fabrication facility.