Used EBARA 300e #9195909 for sale

EBARA 300e Wafer Grinding, Lapping and Polishing System is a precision machine tool designed to meet the demanding demands of the semiconductor market. 300e is a robust and efficient machine offering the highest level of quality and cost-efficiency. At the core of the machine is a grinding, lapping and polishing head with three integrated process stages. This three-stage process allows for efficient and productive workflows. The grinding stage uses diamond-coated grinding wheels for precision grinding to achieve surface roughness and reduce particle size. The lapping stage uses an abrasive slurry to lap the surface of the wafer. Finally, the polishing stage uses diamond pads to achieve a mirror-like polished finish. The grinding, lapping and polishing system is easy to use with CNC multi-function capabilities. The operator interface is intuitive and allows for high process control and flexibility. The machine offers adjustable speeds, pressures, rotations, and levels and is capable of handling a wide range of wafer sizes, up to 300mm. EBARA 300e is designed for safety and is keeping with CE certification standards. All operational and maintenance information is provided in the user manual, and the machine is adapted for automatic closed-loop operation. 300e is a reliable piece of precision equipment which offers excellent performance in wafer grinding, lapping and polishing applications. The machine is made of premium materials and components, providing superior process control and efficiencies. EBARA 300e provides a cost-effective solution to the challenges of modern semiconductor manufacturing.