Used EFG INGOT SAPS #9173291 for sale

EFG INGOT SAPS is a computer-controlled 'wafer grinding, lapping & polishing' equipment specially designed for pre-polishing and grinding of various types of wafers. It is a Machine Integrated Wafer Preparation (MIWP) system that utilizes a specially designed shock-wave abrasive process in order to achieve homogenous grinding and polishing on wafers. The shock-wave abrasive process involves the use of a specifically designed tool (diamond or polycrystalline boron nitride) in order to efficiently grind, lap and polish the material on the wafer surface. Apart from this, the unit has integrated programmable logic controllers (PLCs) that automatically monitor and control the entire grinding and polishing process. It also has a wide array of sensors that quickly detect any abnormality in the grinding and polishing process and send appropriate signals to the PLCs. The machine is capable of grinding, lapping and polishing wafers up to a maximum diameter of 400mm, with a maximum rotation speed of 8,000rpm. It is equipped with an advanced digital electronic control unit that is capable of achieving a feed speed accuracy of ±0.1mm/s. The tool has an intuitive user-friendly graphical user interface (GUI) that helps the operator control various parameters of the process, such as pressure, speed, and type of tool. The GUI also helps in analyzing and presenting the results of the grinding and polishing process, such as surface finish, roughness, and other parameters. The asset further enables cost, accurate analysis and prediction of errors and defects that can occur during the grinding and polishing process, thereby ensuring high efficiency and quality. In order to ensure an efficient operation, the model is equipped with an advanced automation equipment, which helps in the pre-programming of the grinding and polishing process, thereby eliminating human error and allowing for higher accuracy. It also has a feedback system that monitors the material interface during the process, enabling it to adjust the feed rate according to the material interface conditions. Further, the unit has an integrated heat-reducing machine, which helps reduce thermal damage to the wafer during the process. Overall, SAPS is an advanced and reliable wafer grinding, lapping and polishing tool that ensures accurate and homogenous grinding and polishing of different types of wafers. The asset is equipped with an advanced automated model and user-friendly GUI that helps in controlling, monitoring and analyzing the entire grinding and polishing process. Moreover, various heat-reducing and feedback systems in the equipment further ensure an efficient and high-quality operation.