Used ENGIS 16SPCS115V #9143486 for sale

The 'ENGIS 16SPCS115V' is an advanced wafer grinding, lapping and polishing equipment for fabricating semiconductor devices. Featuring a multimode SubstraTec submicron particle suspending grinding system with up to four process stages, this machine is designed to achieve high throughput and world-class grinding results. With a maximum size of a 115mm diameter wafer, this grinder is suitable for larger wafers in need of precision grinding and polishing. 16SPCS115V features a SubstraTec slurry unit, which enables uniform abrasive flow to maximize workpiece finish, as well as precise control of all process variables. The advanced polishing pads help protect the underlying silicon structures while reducing the time and labor of manual polishing. This wafer grinder also features an innovative Abrasive-Free Grinding (AFG) process, which provides a safe, eco-friendly grinding process that is free of all chemical lubricants. The grinder's SubstraTec grinding wheel provides superior polishing results in less time with minimal effort when compared to other grinding and polishing systems. The wheel's unique design features a top grinding layer of inclusions, which offers increased wear resistance and eliminates the need for a separate polishing chamber. The joint design of the wheel and polishing pad ensures an even distribution of finishing material across the surface, resulting in a superhigh finish. ENGIS 16SPCS115V is an ideal choice for micro-device applications on complex materials. The machine's wide range of process parameters allows for precise control of the grinding parameters and process parameters. This wafer grinding machine can achieve micron-level surface finishes with up to 16 pads mounted on the rotating drum for fast and accurate polishing results. The tool is designed for easy operation and maintenance, with a user-friendly graphical interface allowing operators to customize their process settings and monitor process operation parameters. An integrated data logging asset can track and monitor any parameter for record keeping and further process optimization. Utilizing the machine's self-diagnostics capabilities, operators can quickly identify issues and remedy them quickly and efficiently before they cause delay. This high-precision wafer grinding, lapping and polishing model is capable of producing the Ultra High Micro-Finish results demanded in today's semiconductor industry. 16SPCS115V offers a reliable, low-cost solution to wafer grinding, lapping and polishing challenges. Its unique, multifunctional capabilities help ensure that the highest-quality wafer micro-finish standards are achieved.