Used ENGIS EJD-6B #9143470 for sale

ENGIS EJD-6B is a wafer grinding, lapping and polishing equipment designed to meet the needs of a variety of applications. This system utilizes a drum-type carrier to process multiple wafers simultaneously. EJD-6B is equipped with a patented two-stage polishing process that ensures high levels of surface finish and flatness. The unit provides a unique combination of cost efficiency and flexible control, making it an ideal solution for the production of high quality wafers in both production and research environments. ENGIS EJD-6B ensures uniform and consistent grinding, lapping, and polishing of multiple wafers simultaneously. The machine is configured with both a single and multi-stage direction-release lap to precisely control the grinding and lapping process. The single-stage lap features a quick-action mechanical release mechanism, while the multi-stage lap provides user-controlled release, allowing for the greater control of grinding and lapping direction. Additionally, the tool features a continuous repeat-run capability, allowing for the optimization of process parameters and the production of an enhanced overall surface finish. EJD-6B also provides integrated control features, such as precision speed adjustment and spindle speed control, to ensure highly precise and repeatable grinding and lapping results. Additionally, the asset features a proprietary software package, allowing users to adjust process velocities and positions in order to optimize their grinding and polishing requirements. Moreover, the model can be rapidly re-programmed to accommodate a variety of wafer thicknesses and diameters, providing superior process flexibility. Finally, ENGIS EJD-6B utilizes a sound enclosing construction, which ensures user safety while delivering quiet operation. The equipment also includes an automated safety system, which switches off the machine immediately when emergency conditions occur. In addition, EJD-6B utilizes a dust-collection unit to ensure clean operation in both research and production environments. ENGIS EJD-6B is a highly accurate and reliable wafer grinding, lapping and polishing machine ideal for research and production environments alike. This tool features multiple wafer grinding, lapping, and polishing capabilities, providing users with an efficient and cost-effective solution for wafer production. EJD-6B also incorporates integrated control and safety features, allowing users to optimize their process parameters and maximize their product yields.