Used ENGIS EJW-610IFN #9143437 for sale

ENGIS EJW-610IFN 'wafer grinding, lapping & polishing' equipment is an advanced solution for a variety of abrasive applications, providing outstanding performance in grinding, lap polishing, and lapping of hard and soft materials. This system is suitable for a variety of industries, from automotive, medical and electronic device manufacturing to semiconductor production. EJW-610IFN is capable of automatic & manual operation for multiple processes, allowing for a range of precision and speed settings for processing a variety of material types. The unit features automatic grinding and lapping, allowing repeatable and accurate profile and finish results. The work table can be manually adjustable with a range of angular adjustment and the grinding head is convertible depending on the application. ENGIS EJW-610IFN has an automated wafer pick & place loading feature, with an ergonomic arm design that provides easy loading of wafers onto and removal from the main body. An adjustable carrier machine is featured with machined steel ramps and precision turntables providing an effective, stable platform for the accurate grinding of wafers up to 8" (200mm) diameter. The tool also has a high pressure asset for accurate lapping for soft, hard and brittle materials and is capable of stationery and segmented (stroking) motion. EJW-610IFN includes a range of spindle speeds up to 2500 RPM and is equipped with an effective force feedback model for enhanced performance. The PU spindle suspension equipment is electrically controlled for grinding and lapping and it can be switched between manual and automatic operation. A range of polishing processes can be performed from diamond abrasive polishing to Reactive Ion Etching (RIE). The system includes a range of control functions such as speed monitoring, emergency stop, and start /stop control. ENGIS EJW-610IFN is compatible with most EDM process and has a data display interface that allows for monitoring of the grinding process and data logging of results. EJW-610IFN is a reliable and versatile solution for any application requiring state-of-the-art grinding, lapping and polishing technologies. The unit is designed for manual or automatic operation and provides a quality finish on a wide variety of materials. It is easy to use, user-friendly, and can be adjusted with precision.