Used ENGIS EJW-910T-4AL #9388514 for sale

ENGIS EJW-910T-4AL
ID: 9388514
Polishing machine.
ENGIS EJW-910T-4AL is an advanced wafer grinding, lapping, and polishing equipment designed to enable processes from single-side lapping and polishing, backside metrology, through to double-side grinding, lapping, and polishing. The system is fully programmable, allowing parameters such as pressure, speed, and speed-change intervals to be adjusted according to the specific process requirements. It can support components up to 910mm in diameter, with a maximum thickness of 25mm (20mm with a double polishing unit). The machine features advanced drive motors coupled with precision-machined dual-planetary heads which provide accurate and repeatable results in volume production. It also features an intuitive operating tool which incorporates touch-screen technology and automated feed indexing that is fully integrated and easy to navigate. For advanced control, the asset provides a range of options for process monitoring. Process parameters can be monitored in real-time and recorded for post-processing review. Additionally, the model includes a range of advanced technologies which enable the use of higher grinding forces and head speeds to optimize throughput and process robustness. The integrated vacuum/ static-jet dust extraction helps to reduce airborne particles and contain grinding, lapping, and polishing dust. The equipment is equipped with a built-in chill water plant which helps to minimize heat buildup during the lapping/ polish process. The system features a range of advanced manufacturing, measurement, and data acquisition capabilities, such as inline metrology, surface texture measurement, blade curvature analysis, strain-gauge sensors, and quality control tests such as process repeatability verification, part flatness, and waviness measurement. Overall, EJW-910T-4AL is an advanced wafer grinding, lapping, and polishing unit which enables the benefits of advanced wafer processing and the highest levels of production throughput, quality, and repeatability in any wafer production environment. The machine is designed for easy operation and maximum configurability, providing the flexibility needed to meet any application.
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