Used ENGIS EJW460 #9157082 for sale

ENGIS EJW460
ID: 9157082
Lapping systems.
ENGIS EJW460 Wafer Grinding, Lapping & Polishing equipment has been developed to deliver precise and repeatable grinding, lapping and polishing processes required in today's semiconductor and advanced technology industries. With fully automated control and easy to use operation, EJW460 allows for the preparation of flat surfaces to the finest finishing requirements. The system consists of a three-axis CNC grinding, lapping & polishing table, grinding/polishing motor, lapping & polishing head, and a four-channel drive amplifier/controller. This integrated unit, controlled through a single control panel, enables the operator to save time and precision for critical processes. The machine features a very high positional accuracy (+/- 5 microns) in repeatable mode due to the 1,200 rpm CNC feed rate and the stepper motor drive. The tool is operated using ENGIS ProSoft toolkit for Windows-based computers. It allows the user to create process parameters and select the appropriate grinding, lapping and polishing speed and head settings. The easy user interface provides users with a list of all available parameters which can be varied according to specific requirements. The grinding element is a diamond abrasive grinding wheel which is specifically used for polishing. The head is mounted on the indexing table and adjustable in height for optimal abrasive contact. The lapping & polishing head of ENGIS EJW460 is mounted with a three-axis movement and adjustable for both height and angle, while the motor features a brushless DC design for maximum processing speed, efficiency, and power. The four-channel drive amplifier/controller is designed to control the speed and direction of the grinding and polishing motor as well as the lapping and polishing head. The asset also has several operational safety features, including an emergency stop button and anti-slip clamps to ensure safety, as well as a low profile exhaust collector to manage the grinding dust. EJW460 Wafer Grinding, Lapping & Polishing model is designed to provide customers with an accurate and repeatable process for all flat surface preparation in a wide variety of industries. With its precision, high-speed processing, and reliable design, ENGIS EJW460 equipment offers an unsurpassed level of quality and productivity for any surface pre-processing application.
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