Used ENGIS FL-15 #293592372 for sale

ENGIS FL-15 is a powerful wafer grinding, lapping and polishing equipment. It is designed to meet the demanding requirements of today's wafer manufacturing processes. Capabilities include grinding of wafers and thin films with both conventional and smallest grain diamond abrasives, in addition to advanced processes such as etching and oxide removal. The unit includes a range of techniques including chemical-mechanical planarization (CMP), lapping and double-sided polishing, with the capability of grinding, lapping and polishing wafers up to 300 mm in diameter. FL-15 is specifically designed for high production volumes requiring quick turn-around time for wafer polishing. ENGIS FL-15 features a main spindle, which is supported by a heavy-duty bearing structure for precision grinding, lapping and polishing operations, and is equipped with a high precision air bearing spindle, capable of producing exceptional grinding results in a very narrow tolerance range base. The unique design and construction of FL-15 enables the integrated vacuum system, which ensures accurate part alignment, enabling the highest accuracy grinding, lapping and polishing of all wafer sizes. ENGIS FL-15 is also equipped with a digital touch-screen controller, providing simple, intuitive interfaces to efficiently manage the entire process. The unit also includes a host of additional features, such as recipes, libraries, user/group access permission, as well as capability to monitor and adjust parameters such as machine speed and force. The integrated operator security tool provides multi-level authentication and access control. FL-15 has a range of built-in features designed to ensure the highest precision grinding and polishing processes. Features such as the automatic alignment of polishing pads, the secure clamping of workpiece carrier and the protection of results from outside interference make it ideal for processing of advanced difficult to machine materials such as ceramics, metals and plastics. ENGIS FL-15 is a powerful and reliable asset for high volume wafer grinding, lapping and polishing. The highly accurate grinding, lapping and polishing results are achievable due to the unit's innovative features, such as its intuitive touch-screen controller, enhanced automation and multiple security levels. With a wide range of customizable settings, FL-15 can adapt to a variety of wafer production applications, increasing production times, ensuring the highest quality of parts, while also maintaining the standards of safety.