Used ENGIS / HYPREZ EJW-400ASF-ARSE #293606280 for sale

ENGIS / HYPREZ EJW-400ASF-ARSE is a state-of-the-art wafer grinding, lapping & polishing equipment that combines versatile offhand grinding, lapping, and polishing systems. This system is used for wafer processing and is used in industries such as semiconductor and micromachining. This unit provides fast and accurate removal of metal, ceramic and glass materials using the diamond abrasive process. ENGIS EJW-400ASF-ARSE is capable of removing metal, ceramic, and glass materials from the surface of a wafer with an accuracy and precision of up to 50nm. It has an interchangeable media supply cabinet and the user is able to change the media used in the machine quickly and easily. It also comes with an integrated dust collection machine that collects any debris and dust that may be created during wafer processing. The tool is equipped with a media trimmer that can trim and remove media for a precise and consistent finish. HYPREZ EJW-400ASF-ARSE also features a high-accuracy closed loop motion control asset. This model monitors and controls the linear motion and speed of the machine to ensure optimal performance and excellent results. The machine is also equipped with a touch screen interface and the user is able to adjust various programming parameters to ensure consistent results. The equipment is powered by a high powered motor that delivers up to 25 hp for fast and efficient wafer processing. The machine also comes with a powerful optical profiling system that can measure flatness, size and shape of the finished wafer. Additionally, the machine is also able to accurately control wafer temperature to ensure the best performance. EJW-400ASF-ARSE is an excellent choice for high precision grinding, lapping, and polishing of wafers. It is well-equipped with a range of features and technologies that make it suitable for a variety of wafer processing applications.