Used ENGIS THG-170 #9185382 for sale

ENGIS THG-170 is a precision wafer grinding, lapping, and polishing equipment unique in its ability to accommodate large wafer diameters up to 170 mm with superior process precision in one step. This system, made by ENGIS Superabrasives, provides precise, defect-free surfaces for both automated and manual operations. THG-170 unit is fitted with diamond grinding wheels and can process flat, rectified, and stepped alumina, quartz, and silicon carbide wafers. Additional preparation and finishing, like tape adhesive removal, can be done with ENGIS THG-170 through options like an absorbent pad cleaning station. THG-170 has a robust structural design for increased efficiency, making it an ideal choice for the most exacting production environments. It has a floating, dual-pressure platen which provides for reduced substrate warping during grinding, and the precision-balanced grinding wheels ensure process accuracy and repeatability. The use of independent XY-Axis transducers allows for accurate tracing of the exact location of the wafer surface. The built-in air-bearing spindle provides for outstanding grinding accuracy as well as built-in dynamic balancing. ENGIS THG-170's digital controls allow for easy access to process parameters and operator-adjustable wafer grinding, lapping, and polishing programs. As well, the machine is especially suited for continuous high volume production runs with its built-in process repeatability and tracking capability. For extra process control THG-170 includes sophisticated feedback systems that track the wafer thickness and keep precise control of the grinding process. Overall, ENGIS THG-170 wafer grinding, lapping, and polishing tool is a versatile and reliable solution for the most demanding production operations. With its rugged construction, precise grinding and lapping capabilities, and comprehensive control systems, THG-170 provides for highly efficient, high quality processes with minimal operator errors.