Used FENGLEI (Wafer Grinding, Lapping & Polishing) for sale

FENGLEI is a well-known manufacturer of wafer grinding, lapping, and polishing equipment. Their range of equipment includes various models such as the Edge grinder, Double-sided lapping machine, and Single-sided polishing machine. The Edge grinder is designed for precision grinding of the edges of wafers. It features a high-speed rotating grinding wheel that ensures uniform and efficient removal of material from the wafer edges. This machine is known for its accuracy and reliability in achieving precise edge quality. FENGLEI's Double-sided lapping machine is used for fine grinding and polishing of both sides of the wafer simultaneously. It employs a unique lapping plate that ensures uniform material removal and excellent surface finish. The machine offers high productivity and superior flatness control, making it suitable for mass production applications. The Single-sided polishing machine by FENGLEI is specifically designed for polishing one side of the wafer. It utilizes a rotating polishing pad and controlled pressure to remove scratches, oxide layers, and other surface defects. This machine delivers consistent results and is widely used in the semiconductor industry. FENGLEI's wafer grinding, lapping, and polishing systems have several advantages over their analogues. They are equipped with advanced control units for precise and repeatable operations. The machines are designed for high throughput and can handle various wafer sizes. Additionally, FENGLEI offers customized solutions to meet specific customer requirements. Overall, FENGLEI's wafer grinding, lapping, and polishing machines are trusted by semiconductor manufacturers for their reliability, precision, and superior performance. They are ideal for achieving the desired surface quality and flatness required in wafer fabrication processes.