Used FUJI TECHNICA 3B-7P #9143453 for sale

FUJI TECHNICA 3B-7P is a robust and versatile wafer grinding, lapping and polishing equipment designed for research and production applications. It is able to lap and grind wafers ranging in thickness from 0.1 mm to 300 mm, with a sample size of up to 200 mm in diameter. 3B-7P system uses a combination of machines to handle wafer grinding, lapping and polishing. The grinding machines use a diamond wheel to shape the wafer, while a simultaneously lapping machine polishes the surface. Lapping and polishing are both carried out using a suspension consisting of an abrasive material suspended in water. FUJI TECHNICA 3B-7P unit has an integrated grinding, lapping and polishing station that is capable of producing flat surfaces, rounded surfaces and contours with high precision. This process includes a pre-cutting of the sample before the actual lapping and polishing is carried out. The final machining may include planar grinding by a single wafer or by multiple wafers in order to minimize the length of the lap pass. The samples can be prepared as required for high precision applications. 3B-7P machine uses a single spindle with a feed speed of up to 60 rpm. The spindle angle can be adjusted from horizontal to vertical and from left to right to obtain optimal processing conditions. FUJI TECHNICA 3B-7P tool can also be equipped with an auto-sensing lapping station that can detect the sample size inserted, and design the best polishing strategy for the intended application. The auto-sensing station also enables the asset to automatically set the optimal processing condition for the lapping and polishing of the wafer. 3B-7P model also has the flexibility of being programmed to process wafer materials of various thicknesses and diameters without manual re-adjustment. Furthermore, FUJI TECHNICA 3B-7P equipment is able to run in both wet and dry modes, capable of processing hundreds of wafers at a time with a high level of repeatability based on its ability to use the auto-sensing lapping station. In summary, 3B-7P system is a total wafer grinding, lapping and polishing solution that is designed to function with precision and accuracy. It is capable of grinding, lapping and polishing a variety of wafer materials quickly and efficiently while offering process flexibility and repeatability. FUJI TECHNICA 3B-7P unit is a reliable and reliable solution for any laboratory or production facility.