Used HAMAI 16BF-4M-5L-2L3M #9273144 for sale

HAMAI 16BF-4M-5L-2L3M is a versatile wafer grinding, lapping and polishing equipment designed for use in semiconductor manufacturing and other fine-surface polishing applications. The system's four motor design delivers up to five axes of grinding and lapping and is capable of producing mirror-like finishes on ultra-smooth surfaces. The unit is composed of three major sections: the lapping plate, the grinding spindle, and the polishing pad. The lapping plate is the workpiece holder, which can quickly attach and secure the workpiece and hold it in place while the grinding and lapping process is performed. The grinding spindle is the actual grinding and lapping head, which contains motors that are capable of delivering the precise movement needed to achieve the desired finish. The polishing pad is an adjustable plate designed to hold the polishing film, which is usually applied to the grinding spindle. The lapping plate has an integrated automatic clamping machine that is specially designed to securely grip the wafer while it is being processed. The clamping tool consists of a pair of mechanical clamps with a pneumatic cylinder that is used to tighten and release the clamps automatically. The grinding spindle is a three-axis rotary mechanism with a drive motor and three actuators that allow the grinding and lapping head to move in the x, y, and z directions. The grinding spindle also has a cooling asset that prevents the tool and workpiece from overheating during the machining process. The polishing pad is a two-axis motorized base that enables the polishing film to be precisely positioned around the spindle. The polishing pad is adjustable to accommodate different film thicknesses and is designed to reduce vibration and improve the finish of the piece. This model is capable of producing high-quality ultra-smooth mirror-like surfaces with accurate edge geometry. The entire process can be monitored and adjusted for optimum performance, and the equipment is compact and energy efficient, requiring little maintenance. 16BF-4M-5L-2L3M is an excellent choice for grinding, lapping, and polishing a wide range of wafers and substrates. Its versatile design and advanced technology make it an ideal choice for demanding precision production applications.