Used HAMAI 16BF #293615471 for sale

HAMAI 16BF is a one-of-a-kind wafer grinding, lapping, and polishing equipment that allows users to achieve extreme precision while obtaining the best possible surface finish. The system is designed to be used in a variety of different applications, such as MEMS, optoelectronics, microelectronics, and semiconductors. The unit is based upon a rotating wafer polishing table that provides relative and stationary motion. 16BF allows for variable speed rotation for both grinding and polishing operations. This allows for infinite speed adjustments to ensure precision control and optimum results. The variable speed feature also allows the user to program in a number of different cycles and speeds to ensure the highest quality finish. The machine also boasts accurate temperature and fluid flow control to ensure optimal performance. The tool features a unique counter rotating spindle design broken into three stages. The first stage is a C-axis motion that allows for dynamic rotational/reciprocating motion of the grinding/lapping disk. The second stage is a two-axis platform that allows for simultaneous rotation/reciprocating motion of both the grinding/lapping disk and diamond-impregnated polisher pad. The third stage is a linear platform that allows for precise control of the vertical cut rate. HAMAI 16BF is equipped with a sophisticated automated control asset that simplifies operation, ensures accuracy and increases throughput. The model also has an automatic wafer serialization that helps to improve traceability and process control. Additionally, the machine incorporates an extensive range of process monitoring devices including a vision equipment, process cycle counters and data logging systems. The machine is an innovation in standard in-line lapping/polishing systems and is equipped to serve a variety of industrial applications. Its user friendly design, advanced technology and reliable performance increase efficiency, reduce costs and ensure quality results. Its features set it apart from the competition and make it an ideal solution for the precision grinding and lapping/polishing of a variety of wafer products.