Used HAMAI 16BN-3M5P #9007422 for sale

HAMAI 16BN-3M5P
ID: 9007422
Vintage: 2001
Polishing Machine, 3motor, LCD touch panel, tank attached, 2001 vintage.
HAMAI 16BN-3M5P Wafer Grinding, Lapping & Polishing Equipment is a precision machine that utilizes diamond grinding and lapping to quickly, precisely and consistently produce superior surfaces and finishes on wafers of all sizes. The system is designed for a wide range of applications such as CMP, epitaxy layers, thin films and defect repair. The 3-spindle grinding head can grind with three different diamond wheels simultaneously for faster throughput. In addition to grinding the wafer grinding unit can perform lapping and polishing processes. The 15" inspection station is integrated into the machine, allowing for manual and optical inspection of the wafer surface. 16BN-3M5P is equipped with a 3-axis linear slide for accurate in-process and post-processing inspection. The tool is designed to accommodate all types of manual and automated wafer handling from cassette to cassette transport with single-wafer loading and unloading as well as automated sequence loading. The wafer handling asset can be customized to accommodate special wafer types and substrates. The wafer grinding model features a programmable controller and a Japanese-made master inverter drive motor. This motor allows for the processing of a variety of surfaces and finishes. Additionally, the equipment can be adapted to incorporate into a fully automated production line. The system is also built to ensure repeatability and consistency. It has 10 programmable recipes with 100 steps and is equipped with a data logging unit that stores temperature, RPM and other measurements. HAMAI 16BN-3M5P also features a speed ramping function that precisely adjusts the grit rates and polishing speeds. 16BN-3M5P Wafer Grinding, Lapping & Polishing Machine is suited for any operation requiring superior micro-finishing on all types of wafers. It is designed to quickly and accurately correct surface defects, clean and polish the wafer surfaces and perform a range of lapping and polishing applications. The tool's high flexibility and performance makes it the perfect choice for any production demands.
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