Used HAMAI 16BN-3M5P #9007423 for sale

HAMAI 16BN-3M5P
ID: 9007423
Vintage: 2000
Polishing Machine, 3motor, LCD touch panel, tank attached, 2000 vintage.
HAMAI 16BN-3M5P is a wafer grinding, lapping and polishing equipment designed for advanced materials processing. The system utilizes an advanced, fully automated control unit and computer numerical control (CNC) technology to deliver consistent results and superior accuracy for materials polishing, including single- and multi-crystalline wafers. 16BN-3M5P machine is designed to polish wafers from 30mm to 300mm in diameter and up to 63mm thick. It is equipped with a 3-axis motion tool, and a rotary actuator to control grinding, lapping, and polishing operations. The asset is fitted with the latest infrared sensors to ensure precise control and optimal processing. HAMAI 16BN-3M5P also includes a high-throughput grinding, lapping, and polishing unit with an array of spindles and a rotary-mounted diamond grinding wheel. This spindle-based model is capable of processing a wide variety of materials, from fragile lightweight substrates such as ceramics and Li-ion batteries, to harder materials such as sapphire and silicon carbide. The grinding, lapping, and polishing process is separated into four distinct steps: Preparation, Grinding/Lapping, Finishing, and Quality Control. During preparation, the materials are prepared by grinding, lapping, and polishing machines in order to create the desired surfaces and features. During Grinding/Lapping, spindles adhere to the material and the diamond grinding wheel rotates at high speed to abrade and level the wafer's surface. During the Finishing phase, the polishing process is employed to remove scratches and level the surface in order to create an even finish. Lastly, Quality Control is employed to inspect the material in order to verify its accuracy. Overall, 16BN-3M5P is a high-performance wafer grinding, lapping, and polishing equipment capable of producing high-quality results in a short amount of time. It is an ideal system for those who require high-precision material finishing and polishing. With its advanced control unit, automated features, and excellent results, theHAMAI HAMAI 16BN-3M5P is an outstanding choice for material processing in the semiconductor industry.
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