Used HAMAI 20BN-P #9273129 for sale

HAMAI 20BN-P Wafer Grinding, Lapping & Polishing equipment is a high-performance wafer processing machine used for surface preparation on substrates such as optical substrates, LED, semiconductor and WLD chips. This system is able to manipulate and process a range of substrates and materials, including quartz and sapphire, as well as a range of other semiconductor materials. HAMAI 20 BN P unit consists of two main components: a horizontal platen, used to hold the substrate, and a grinding/lapping/polishing tool. The platen is equipped with a high performance, low-friction air bearing and has a range of variables for controlling speed and parameters. This allows for precision manipulation and grinding of the substrate material. The polishing tool consists of a diamond-abrasive disc that can be fine tuned for a range of materials and applications. The machine also has adjustable speeds for both the polishing tool and platen, and can accurately measure surface topography to ensure optimal results. The pressure exerted by the grinding/lapping/polishing tool is adjustable, allowing for increased process control and fine-tuned results. The high precision of 20BN-P tool also extends to the actual grit size being used, and corresponding pressure levels, allowing for an optimal precision finish with minimal or no residue. The asset also includes additional tools to aid in the grinding of complicated surface structure components such as notches, ridges and grooves. 20 BN P model is equipped with an advanced automated surface control equipment which automatically stops the grinding process once a predetermined surface finish is achieved. This allows the system to programmatically adjust surface finish parameters, significantly reducing the amount of time and labor needed to manually adjust and regulate the process. HAMAI 20BN-P unit is also very fast and accurate, quickly achieving a high level of detail and finish on substrates, even when on a production line. Overall, HAMAI 20 BN P Wafer Grinding, Lapping & Polishing machine is a powerful, reliable and flexible machine for substrates preparation. With its precision manipulation and process control, 20BN-P tool is a reliable tool, ideal for a range of wafer processing and surface finishing applications.