Used HAMAI 4BF #9257678 for sale

HAMAI 4BF is a state-of-the-art wafer grinding, lapping, and polishing system, designed for precision wafer processing in the semiconductor and other industries. 4BF is an all-in-one machine featuring four grinding and polishing heads that can accommodate wafers ranging in diameter from 2" to 10" (50-250mm). The machine also features integrated air and coolant systems, a video camera, and a PLC controller that can be programmed to automate the entire process. The grinding, lapping, and polishing process begins with the first stage, which uses diamond grinding strips to coarsely grind the wafers. At this stage, the wafer begins to take shape, and the diamond grinding strips smooth out any imperfections on the surface of the wafer. After grinding, the second stage uses lapping disks to remove any remaining imperfections along edges and corners. On the third stage, the wafer is polished using diamond impregnated polishing papers. This also helps to create a smooth, uniform finish to the wafer's surface. On the fourth and final stage, the wafer is further polished using a felt polishing pad. At each grinding, lapping, or polishing step, HAMAI 4BF's PLC controller gauges the wafer's surface and adjusts the process accordingly. This ensures the precision of the process and ensures that the wafer's surface is free of all surface imperfections. 4BF's air and coolant systems also help to protect the wafer from heat buildup, increasing its accuracy and surface uniformity. The machine's integrated video camera also allows for a clear view of the wafer's surface during each step of the process. HAMAI 4BF is designed for high accuracy and high-quality wafer processing. Its integrated systems ensure that the entire process is automated and precise, enabling repeatable results with each wafer. Furthermore, the system's design is scalable, allowing for future upgrades and modifications as needed. 4BF is the ideal choice for precision wafer grinding, lapping, and polishing.