Used HAMAI 4BF #9257682 for sale

HAMAI 4BF
ID: 9257682
Vintage: 1999
Double sided lapping machine 1999 vintage.
HAMAI 4BF Wafer Grinding, Lapping & Polishing Equipment is designed for efficient, high-quality processing of silicon and compound wafers. Utilizing advanced diamond lapping and polishing techniques, the system provides ultra-high surface finishes and accurate, repeatable flatness for a wide range of wafer sizes and thicknesses. The unit features two independent work cells for grinding and polishing, with a fully automated process control and feedback machine. The tool is constructed with high-grade, corrosion-resistant components to ensure accurate, reliable performance over its lifetime. The lapping and polishing work cells feature precision axis travel systems and advanced servo motors. This allows for high-end capability with high precision and repeatability. 4BF also offers a wide range of grinding wheels and diamond laps for a variety of grinding, lapping, and polishing tasks. The asset is simple to operate, with two programmable operator panels for each station and live feedback from wafer sensors that continuously monitor grinding progress. The display is capable of displaying both sequential step operation and real-time sensor feedback, ensuring maximum efficiency. The intuitive user interface and safety features make it easy and safe to operate. HAMAI 4BF also includes an automated fluid dispense model, which ensures accurate, repeatable lubrication and polishing agents are applied to the wafers. This equipment is equipped with a full range of filtering, air-pressure, and temperature control options to ensure optimal performance and safety. The system also offers specialized software, which is capable of monitoring and adjusting the grinding parameters, such as pressure, speed, diamond grade, and abrasive size, to address specific wafer/material requirements. This powerful software provides the tools necessary for performing a wide variety of finishing operations, including the polishing of difficult materials with tight tolerances. 4BF Wafer Grinding, Lapping & Polishing Unit is an ideal solution for delivering precise, repeatable results. Its intuitive user interface, safety features, and powerful software allow for easy, efficient operation, and its robust construction ensures long-term reliability. The machine is perfect for grinding, lapping, and polishing a wide variety of materials with extreme precision.
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