Used HARVEY J-30E #9382492 for sale

Name: HARVEY J-30E
Brand: HARVEY
SKU: 9382492
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

HARVEY

Model

J-30E

ID: 9382492

CNC Sawing machine Main base unit Swing arm Crosscut table Crosscut fence Sliding table Edge shoe plate Rear extension table Blade guard with riving knife Main table Side extension table Rip fence (Round guide bar) Rip fence (CNC) Sliding table handle Connector plugs Switch box: With text display Without text display Overhead guard Switch box with touch screen Support leg Power requirements: 400V, 50 Hz, 3 Phase 5.5 kW.

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HARVEY J-30E is a wafer grinding, lapping and polishing equipment that offers features such as semi-automatic grinding and polishing, high-speed lapping and polishing and exceptional precision operation. The system can grind, lap and polish a wide variety of materials including silicon, gallium arsenide, ceramic, color filter and other final polishing materials. This high-precision, easy-to-operate unit ensures consistent processing of up to 24 wafers per lot. The machine is equipped with a built-in oscillator, which allows for precision grinding and accuracy in all axes. This oscillator also reduces vibration, reducing tooling wear and tear. Meanwhile, the high-speed lapping and polishing capabilities ensure a consistent and repeatable wafer surface finish. A unique feature of J-30E tool is its semi-automated operation. Its user-friendly graphical interface simplifies and automates operator operations, allowing operators to preset and store operating parameters. In addition, the asset comes with process monitoring capability, which can be set to alert operators to any possible problems. HARVEY J-30E model is designed to maximize output. Its innovative software allows operators to increase throughput by containing several process steps in one lot. Additionally, its cassette-to-cassette design ensures consistent production, even during repeated processes and multiple process steps. In terms of safety and ergonomics, J-30E equipment is designed with safety in mind. It has audible and visual alarm systems to alert operators to any possible hazards, while its low-height operating panel eliminates the need for a ladder or platform to reach the controls. Overall, HARVEY J-30E wafer grinding, lapping and polishing system is a powerful and efficient machine that offers precision operations, semi-automated operation, maximum throughput and safety and ergonomic advantages for operators. Its user-friendly graphical interface and process monitoring capabilities make it perfect for wafer processing applications.