Used ICHIKAWA ICB-610F #9156516 for sale

ICHIKAWA ICB-610F
ID: 9156516
Vintage: 1990
Rotary grinder 1990 vintage.
ICHIKAWA ICB-610F is a world-class wafer grinding, lapping, and polishing equipment designed to meet the stringent requirements of semiconductor fabrication. This leading-edge system comprises a workpiece holder, a spindle for grinding, a lapping plate, and a polishing wheel, all driven by a powerful and reliable drive unit. The parameters for this unit are customizable and can be set according to the desired output. The highly precise and programmable spindle is capable of rotating at up to 3000 rpm and is ideal for grinding down wafers quickly and efficiently. The spindle head may also be swiveled to enable workpieces to be ground, lapped, and polished for maximum efficiency. The lapping plate can be adjusted in the vertical and horizontal direction to allow for various types of grinding and polishing operations for flat surfaces, curves, and other shapes. The plate can incorporate various abrasive elements such as diamond, cobalt, and silicon carbide, and is a crucial element for producing high-quality surfaces. The polishing wheel is another key component in the machine, and is capable of rotating at up to 500 rpm. It is ideal for grinding and polishing wafers of varying thickness with uniform and consistent results. The wheel is fully configurable and may be manipulated in the speed, direction, and force of rotation to achieve optimal results. The drive unit is a reliable and powerful motor with a high torque output that operates in a quiet and vibration-free fashion. It is able to deliver up to 15 Kw of power and runs at a low electrical current, resulting in high energy efficiency. The motor is also highly programmable and is capable of producing repeatable results that exceed the industry's expectations. Overall, ICB-610F is a top-of-the-line wafer grinding, lapping, and polishing tool that is designed to get the job done with precision and efficiency. Its state-of-the-art components, features, and motors combined with its customizable parameters make it the go-to asset for any semiconductor fabrication facility.
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