Used IPEC / WESTECH / SPEEDFAM 372M #10195 for sale

IPEC / WESTECH / SPEEDFAM 372M is a multi-axis automated wafer grinding, lapping, and polishing equipment designed for processing advanced semiconductor materials. The system is designed to accommodate a large range of wafer sizes from 4" to 8" and features advanced high-precision motion control for maximum performance and throughput. IPEC 372M's grinding, lapping, and polishing capabilities provide the semiconductor manufacturing industry with superior control and automation for highly consistent production. The high-speed, high-precision motion unit supports accuracy of ±0.00012" for repeatable and consistent results. This machine is capable of processing 8" wafers in a single run, with speeds up to 20,000 rpm and a width of 12" for optimal surface finish. WESTECH 372M features a proprietary spindle tool that uses hybrid ceramic bearings and is designed to maintain tight process control while operating at increased speeds. The integrated controls support dynamic load response with speed accuracy and repeatability of ±0.1%. SPEEDFAM 372M utilizes a number of advanced control systems and precision feedback systems that enable advanced process control and real-time tuning. The integrated wafer chucking asset provides a reliable process and superior holding force while maintaining accurate alignment. This model is designed with a modular platform that allows for simplified installation, maintenance, and upgradeability. The embedded diagnostics equipment helps detect and isolate errors quickly and accurately to reduce downtime and improve service visibility. 372M supports a variety of polishing processes to provide superior uniformity and smooth surface finishes over a wide range of materials. The system is designed to handle a variety of materials, from silicon and carbon to glass and Sapphire, and is fully customizable based on application requirements. Overall, IPEC / WESTECH / SPEEDFAM 372M multi-axis unit provides superior performance, accuracy, and repeatability for a wide range of grinding, lapping, and polishing applications. The modular design, integrated controls, and advanced motion systems provide the semiconductor manufacturing industry with a powerful tool for consistent and reliable production.