Used JUNG C 740 #9066953 for sale

JUNG C 740 is a wafer grinding, lapping, and polishing equipment that offers high precision processing capabilities. It is ideal for processing thin silicon wafers. The system features a high-performance grinding spindle and plate that allow for simultaneous grinding, lapping, and polishing of up to 10 wafers per run. C 740 has a wide array of features built to optimize accuracy and throughput. At the heart of the unit is a high-speed grinding spindle, capable of operating at speeds up to 20,000 rpm. This spindle provides a precise, uniform grinding action and minimizes vibration. JUNG C 740 also features a digital control machine with a user-friendly interface that allows users to quickly set up and monitor the grinding process. The digital control tool also provides real-time feedback, so the user can monitor the process and make necessary adjustments. C 740 is also equipped with a computerized loading and unloading asset. This model includes an automated vacuum lift and optional vacuum swing bowls that make it easy to automatically load wafers onto the grinding plate. The loading and unloading equipment ensures that wafers are loaded and unloaded quickly and consistently. JUNG C 740 also features a convolutional lapping plate that allows users to rapidly lap, polish, and clean the wafers. The plate uses a proprietary silicon carbide grinding media to maintain consistency and repeatability. Additionally, the system is designed to minimize the risk of contamination, as it is capable of sequential processing of 10 wafers at a time. Finally, C 740 includes a number of safety features. These features include an automatic shut-off function, a dust collection unit, and a wide range of sensors that monitor the unit and provide warning alarms in the event of an emergency. This allows users to be safe and secure while working with JUNG C 740. Overall, C 740 is an advanced wafer grinding, lapping, and polishing machine that provides a high level of precision and accuracy in its processing. Its wide array of features and safety systems make it an ideal tool for users who need a reliable and consistent wafer grinding asset.