Used KURODA FKP-1020F #293623146 for sale

KURODA FKP-1020F is a dedicated wafer grinding, lapping and polishing equipment that is able to grind, lap and polish wafers at stages varying from rough polishing to fine polishing. It is most commonly used for the production of high-end advanced semiconductor wafers. FKP-1020F's main component is the grinder, a precision micromotor that utilizes a servo-controlled rotating motor to generate the grinding process. This motor is designed to provide a highly accurate and precise grinding of surfaces, allowing for the production of semiconductor wafers with extremely high-quality flatness and low surface mid-ranges. Alongside the grinder, KURODA FKP-1020F also features a lapping feature that consists of two rotating flat disks that apply a uniform lapping pressure over the surface of the wafer. This is done through a combination of a specially designed, precision spindle and the movement of both the disks and the spindle. The lapping can be fine-tuned according to the specific requirements of clients. FKP-1020F also includes a polishing feature, which consists of a diamond wheel that is used to apply a precise and even polishing pressure to the wafer. This wheel is also equipped with a regulator that enables the user to adjust the polishing pressure accordingly. The wheel's internal components are specifically designed to minimize heat transfer and minimize the potential for damage to the wafer. Finally, KURODA FKP-1020F includes a post-polishing feature, which consists of a set of abrasive cloths that are used to finish off the wafer surface and create a smooth, even finish. This feature is designed to remove any remaining polishing imperfections and create a final smooth, uniform surface. Overall, FKP-1020F is a high-precision wafer grinding, lapping and polishing system designed to provide consistently high-quality results. This unit is specifically designed to meet the needs of the semiconductor industry, and its features are designed to minimize the chances of any damage occurring to the wafer during the grinding and polishing process. The machine is highly accurate and enables the user to fine-tune their results to achieve the exact specifications necessary.