Used LAPMASTER 12 #9124557 for sale

ID: 9124557
Lapping / Polishing Machine, Capacity: 12" DIA.
LAPMASTER 12 is a modern wafer grinding, lapping and polishing equipment which is designed for use in the semiconductor, wafer-level packaging and silicon photonics industries. It offers top performance and flexibility in providing consistent results across a range of grinding, lapping and polishing operations. The system features a powerful 12" diameter horizontally-mounted grinding and polishing wheel for grinding and lapping operations with both manual and programmable features, allowing process parameters to be quickly changed to respond to changing process needs. The unit also features advanced internal software that allows for reliable automatic control of the grinding, lapping and polishing processes. This software has two main features: step-progamming capability for setting process parameters, and advanced parameter optimization. Step-programming capability allows the operator to quickly change process parameters such as feed rate, material removal rate, and pressure distribution to optimized for a specific process, while parameter optimization uses real-time feedback to further refine process parameters to maximize production yield and reduce cycle times. The machine also features a precision feed tool and vacuum assist asset for precise material movement and good vacuum-assisted grinding performance. The front-loading magazine also provides added convenience in loading wafers and parts for the process. LAPMASTER 12 also comes equipped with an intuitive HMI for easy operation and maintenance, as well as an emergency stop switch for safety. In addition to providing top performance, 12 also offers users flexibility for a variety of applications. It can be used with a variety of substrates, from silicon wafers to polysilicon, oxide, metals, and polymer substrates. It is also capable of performing a variety of grinding, lapping, and polishing operations, from in-transit grinding and lapping, optical quality polishing, and controlling edge fractures during polishing. Overall, LAPMASTER 12 is a powerful and versatile wafer grinding, lapping and polishing model ideal for use in the semiconductor, wafer-level packaging and silicon photonics industries. With its advanced software capabilities, precision feed equipment, and user-friendly HMI, it makes the system ideal for today's demanding wafer-level processes.
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