Used LAPMASTER 36 #9288249 for sale

ID: 9288249
Vintage: 2010
Lapping system 2010 vintage.
LAPMASTER 36 is an efficient and reliable wafer grinding, lapping, and polishing equipment developed by Peter Wolters. It produces high-quality single-side lapped and polished wafers up to 300mm in diameter. This system is rated highly for precision and accuracy while providing a versatile, affordable, and repeatable solution. The unit is designed to be set up and operated quickly to reduce setup time and labor. It features a 36" (914.4mm) diameter working area with a rounded edge for a uniform asymmetric lap profile to produce wafers with higher yields and fewer rejects. The working area is adjustable up to 1mm (min) and is suitable for manual or automatic operation. LAPMASTER 36 machine includes a slurry feeding unit, chopper, and jig with variable speed for high precision results. The patented dynamic force compensation technique measures vibration and automatically adjusts the forces to produce uniform grinding and lapping. The jig also has two separate and independent motorized stages for grinding and lapping. This allows the operator to precisely control the process settings to optimize wafer performance. The tool's built-in computerization features make it easy to operate. It features an LCD touch screen display with menus. It allows monitoring of parameters such as the gap between the wafer and the jig, the pressure and the RPM of the chopper. The user can record up to 60 sets of data in the asset's memory and easily reprint the necessary reports for traceability. LAPMASTER 36system is customizable to meet customer's needs and can be adapted with a number of options such as vibration absorbers, coolant systems, safety covers, and specialized tools. This model also offers an optional ceramic blank holder for blank polishing. 36 is an ideal solution for demanding grinding and lapping operations. It is suitable for many applications such as silicon wafer grinding, sapphire grinding, silicon carbide grinding, ceramic wafer grinding, semiconductor wafer lapping, and many more.
There are no reviews yet