Used LAPMASTER 48 #293637429 for sale

ID: 293637429
Lapping machine Pneumatic lift (4) Conditioning rings Coolant (Slurry pump, tank) Lapping plate diameter: 48mm Motor H.P: 10 H.P Wired for 440 V Main drive motor volt: 3 V, 60 V, 220-440 V.
LAPMASTER 48 is a wafer grinding, lapping and polishing equipment designed to deliver precision surface finishing results with greater throughput. It is well-equipped to meet the needs of a wide range of industrial applications, including Silicon, Boron Phosphide, Aluminum Nitride, Silicon Carbide, Aluminum Oxide, and more. The system features an automated 4-axis unit with edge support capability, providing the capacity and capability to process substrates up to 8" in diameter. 48 is operated by a custom graphical user interface (GUI). The GUI allows the user to quickly and easily program the 4-axis motion, as well as control parameters such as speed, feed rate, and torque. Additionally, it allows for real-time monitoring of the machine's performance and accurate application of process parameters. The GUI is designed to be intuitive, making it easy to use for both experienced and new users. In addition to the comprehensive GUI, LAPMASTER 48 features a powerful motorized spindle capable of 12.6 Nm of torque and 800-6,000 rpm of speed. The spindle is electrically-driven with dual-plane balancing, providing maximum precision and accuracy. The motor is also adjustable, allowing the user to fine-tune the speed and torque as needed. To ensure superior performance, 48 also includes a special bond/polishing disc developed from high-grade materials. The disc is specially engineered for optimum grinding, lapping, and polishing results, making it a great choice for projects requiring high precision and surface finish. LAPMASTER 48 also offers state-of-the-art safety features, including a special spring-loaded safety switch, a dust collector tool, a sealed enclosure, and a protective envelope. Together, these features ensure that the user operates the machine in a safe environment, providing a reliable and safe grinding, lapping, and polishing process. Overall, 48 is an advanced wafer grinding, lapping, and polishing asset that is designed to provide superior quality results, with maximum throughput and safety. Its motorized spindle, powerful motor, and special bond/polishing disc make it the ideal choice for processing a variety of wafer and substrate materials. As a result, LAPMASTER 48 is a great choice for processing projects with demanding requirements and expectations.
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