Used LAPMASTER LP-20D #9237180 for sale

LAPMASTER LP-20D is a powerful wafer grinding, lapping, and polishing equipment that is designed to produce superior surface finishes, minimizing total machining time and cost. It features a slotted lapping plate with a vacuum chuck for holding and accurately positioning the wafer, allowing for precise lapping and polishing processes. The machine is able to complete both single and double-sided wafer processing quickly and efficiently. The system includes a precision spindle and motor that generate driving forces up to 20 Kg-F for grinding, lapping, and polishing processes. The motor is able to drive up to 25,000 rpm, while the platen speed is variable and adjustable for different processes. Additionally, the unit utilizes a precise pressure control mechanism to maintain consistent pressure across the lapping surface for uniform processing of the entire wafer. The machine also includes a real-time smooth and accurate feed tool to ensure that the load is properly held during the lapping and polishing procedure, maintaining consistent and precise pressure. Moreover, LP-20D is designed with a powerful down-force format, to effectively disperse heat, thereby controlling the uniformity of grinding and polishing processes more efficiently. The machine utilizes diamond pastes to create the desired polish finishes. It is equipped with an easy to use digital interface, which controls the process parameters, allowing for quick setup of the machine for lapping and polishing operations. Additionally, multiple process recipes can be stored and quickly recalled. Furthermore, LAPMASTER LP-20D features a unique automated cleaning asset that effectively removes abrasive dust from the lap plate surface, thus eliminating any interference with the lapping and polishing performance. The easy-to-use safety control model ensures safe and reliable operation of the machine, and provides digital monitoring of the entire process. In conclusion, LP-20D is an advanced wafer grinding, lapping, and polishing equipment. It is designed for superior surface finishes, and is highly efficient in both single and double-sided wafer processing. Additionally, the machine features an accurate feed system, digital interface, and automated cleaning unit for better operational performance.