Used LAPMASTER XLP-40FDPC #9143439 for sale

LAPMASTER XLP-40FDPC is a state-of-the-art wafer grinding, lapping and polishing equipment designed for both research and commercial applications. This high-performance system is built for fine-finish processing of semiconductor substrates and related materials. XLP-40FDPC is a multi-station automated unit offering advanced process control features for uniform grinding, lapping and polishing of substrates. It is equipped with advanced machine control software developed specifically for this application. The advanced motion and control solution allows for the precise control of pressure, speed, and torque to optimize the process repeatability and accuracy. LAPMASTER XLP-40FDPC employs a precision XY-stage, which allows for the quick movement of the wafer during the process. This ensures precise alignment to the polishing pad and achieves a uniform results on each wafer. Programmable process sequences give the user complete control over all process parameters. The process can be paused or stopped at any time to make changes or inspect results. XLP-40FDPC comes with a variety of grinding, lapping and polishing accessories, such as pads, diamond and diamond coated disks, polishing films and slurries, for optimal process control. Automatic level control maintains a consistent level throughout the process, while the automatic cleaning option offers enhanced convenience and efficiency. The intuitive Windows-based operator interface allows for easy operation and control of the process. LAPMASTER XLP-40FDPC is designed for cleanroom and normal environment operation. The machine is built with an ultra-low vibration design, which ensures that the results are not distorted due to vibration or temperature variations. Advanced safety features, such as motion control safety shut off and a communications interlock tool to enable emergency stop, ensure a safe working environment for the operator. Overall, XLP-40FDPC is an advanced, high-performance wafer grinding, lapping and polishing asset designed to provide ultra-precise process results. The model is suitable for use in both research and commercial applications, and offers excellent features and control for an optimized substrate processing experience.