Used LECO VP-160 #9133052 for sale

LECO VP-160 is a versatile, high-precision wafer grinding, lapping and polishing equipment. Designed for quality assurance and production applications, VP-160 is capable of producing mirror-like surfaces in a variety of substrates, including silicon, glass and gallium arsenide. The system's design is focused around quality and repeatability. It features an adjustable grinding depth, allowing for accurate control of surface roughness. Additionally, the unit's 3-axis mechanical structure enables precise repeatable grinding positions for uniform wafer loading. This structure also eliminates the need for manual adjustments, reducing the chances of human error. LECO VP-160 uses diamond impregnated grinding wheels, allowing the machine to produce surfaces of up to 1.2 micron root mean square (RMS) roughness. The grinding process is combined with steady pressure and uniform speed, which helps to ensure a consistent surface finish. It also supports aqueous and non-aqueous grind processes, so operators can choose the best appropriate substrate treatment, depending on the application. VP-160 tool is also capable of lapping, a technique which improves surface flatness and eliminates surface defects. This feature is enabled by the asset's operating control model which adjusts lapping fluid pressure, pitch, and speed to ensure optimal lapping performance. Finally, in order to achieve the highest possible degree of surface finish accuracy, LECO VP-160 also offers a polishing capability. This feature takes advantage of diamond slurry particles, which move against the substrate, resulting in a smoother surface with improved clarity and fewer surface defects. By combining all of these features in one equipment, VP-160 is an ideal solution for those needing to achieve and maintain the highest levels of precision and repeatability.