Used MAT INC / MACHINE APPLICATION TOOLS GYR-311MA #293605756 for sale

ID: 293605756
Grinder.
The MAT MAT INC / MACHINE APPLICATION TOOLS GYR-311MA Wafer Grinding, Lapping and Polishing Equipment is a comprehensive and reliable automated manufacturing system designed for grinding, lapping, and polishing wafers. This unit is capable of processing a wide range of wafer substrates, from a few μm in thickness up to 31 mm thick. MAT INC GYR-311MA also features a number of safety features to ensure safe operation, including a no-access safety switch, and an optional dust collection machine to reduce particles created during the grinding, lapping, and polishing processes. MACHINE APPLICATION TOOLS GYR-311MA Wafer Grinding, Lapping and Polishing Tool is designed to accommodate several process parameters, including grinding wheel speed, spindle speed, and lapping/polishing pressure. These settings can be finely tuned to achieve the desired finish and tolerances while also allowing the operator to make manual adjustments in real time. GYR-311MA can accommodate up to 8 grinding, lapping, and polishing spindle assemblies depending on the application. Each spindle assembly houses its own grinding wheel, allowing grinding and lapping operations to take place simultaneously, while the lapping and polishing spindles polishes in 6 axes of motion. The high-precision spindle and wheel assemblies are controlled by an industrial-grade PLC and are programmed to support high-speed, continuous operation on multiple work sites. MAT INC / MACHINE APPLICATION TOOLS GYR-311MA Wafer Grinding, Lapping, and Polishing Asset also features a range of automated features designed to streamline the production process. Cycle time can be easily set up and adjusted and the model is also capable of automatically setting the dimensions and conditions for the wafer before and after processing. MAT INC GYR-311MA also features loading and unloading capabilities, with a robotic arm for fully automated part loading and unloading. MACHINE APPLICATION TOOLS GYR-311MA Wafer Grinding, Lapping and Polishing Equipment is designed for reliability and ease of use. The system is also equipped with a variety of sensors and monitors to ensure accuracy and consistency, while an integrated logic program also simplifies operator training. The unit also includes useful operator functions, including an adjustable lighting machine and LCD display. In addition, diagnostic and tracking functions allow quick and easy identification in the event of a fault.
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